Trystan Casey
The melting point of electrical solder depends on its composition and ranges from 90 to 450 °C (190 to 840 °F; 360 to 720 K). Alloys that melt between 180 and 190 °C (360 and 370 °F; 450 and 460 K) are the most commonly used. Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called hard soldering, silver soldering, or brazing. The most common electrical solder, 60/40 Sn-Pb, melts at 188 °C (370 °F).
| Characteristics | Values |
|---|---|
| Melting point range of soft solder | 90 to 450 °C (190 to 840 °F; 360 to 720 K) |
| Melting point range of most commonly used alloys | 180 to 190 °C (360 to 370 °F; 450 to 460 K) |
| Melting point range for hard soldering | Above 450 °C (840 °F; 720 K) |
| Eutectic alloys | Melting point coincides with the freezing point |
| Non-eutectic alloys | Solidus and liquidus temperatures differ |
| Tin-lead (Sn-Pb) solder concentrations | Between 5% and 70% by weight |
| Alloys commonly used for electrical soldering | 60/40 Sn-Pb, 63/37 Sn-Pb |
| Melting points of 60/40 Sn-Pb and 63/37 Sn-Pb | 188 °C (370 °F) and 183 °C (361 °F) respectively |
| Tin-silver-copper (Sn-Ag-Cu, or SAC) solder | Melting point of 217 °C (423 °F) |
| Melting point of lead | 327 °C (621 °F) |
| Melting point of nickel-based lead | Up to 475 °C |
| Melting point range of low-temperature solder alloys | 117 °F (47 °C) to 320 °F (160 °C) |
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What You'll Learn
Soft solder melting point range
Soft solder is a fusible metal alloy used to create a permanent bond between metal workpieces. It is commonly used in electronics, plumbing, and sheet metal work. Soft solder typically has a melting point range of 90 to 450 °C (190 to 840 °F; 360 to 720 K). However, alloys that melt between 180 and 190 °C (360 and 370 °F; 450 and 460 K) are the most commonly used.
Tin-lead (Sn-Pb) solders, also known as soft solders, are commercially available with tin concentrations between 5% and 70% by weight. The greater the tin concentration, the greater the solder's tensile and shear strengths. Alloys commonly used for electrical soldering include 60/40 Sn-Pb, which melts at 188 °C (370 °F), and 63/37 Sn-Pb, which is used principally in electrical/electronic work and has a melting point of 183 °C (361 °F). These alloys are typically used for manual soldering with a soldering iron or soldering gun.
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic, meaning that the alloy's melting point is the lowest possible for a mixture of those components and coincides with the freezing point. Non-eutectic alloys, on the other hand, can have distinct solidus and liquidus temperatures, with noticeable transitions between the solid and liquid states.
Lead-free solders have been increasing in popularity due to regulatory requirements and the health and environmental benefits of avoiding lead-based electronic components. Examples of lead-free solder alloys include SAC305 and Sn99.3/Cu0.7, which have melting points of 430°F (221°C) and 441°F (227°C) respectively. Low-temperature solder alloys have even lower melting points, ranging from 117°F (47°C) to 320°F (160°C).
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Eutectic alloys
Tin-lead (Sn-Pb) solders, also known as soft solders, are commercially available with tin concentrations between 5% and 70% by weight. The 63/37 Sn-Pb alloy is a eutectic alloy that is commonly used for electrical and electronic work. It has a melting point of 183°C (361°F), which is significantly lower than the melting points of pure tin (232°C) and pure lead (327°C).
Another example of a eutectic alloy is the tin-silver-copper (Sn-Ag-Cu, or SAC) solder. This lead-free solder alloy has a melting point of 217°C (423°F) and is widely used in Japan for reflow and wave soldering, as well as for hand soldering. The reduced melting point of this alloy compared to other tin-silver alloys contributes to its popularity.
Nickel can be added to eutectic alloys to form a supersaturated solution, inhibiting the dissolution of thin-film under-bump metallization. Small amounts of nickel (0.5 wt%) can also be added to tin-copper alloys to inhibit the formation of voids and interdiffusion of copper and tin elements. These alloys are known as "nickel-modified" or "nickel-stabilized". Cobalt is sometimes used in place of nickel to improve fluidity and avoid patent issues.
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Lead-free solder alloys
The melting point of solder varies depending on its composition. Soft solder typically has a melting point range of 90 to 450 °C (190 to 840 °F; 360 to 720 K), while alloys that melt between 180 and 190 °C (360 and 370 °F; 450 and 460 K) are the most commonly used. Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is considered "hard soldering".
One common lead-free solder alloy family is Tin-Silver-Copper (Sn-Ag-Cu or SAC), which has a reduced melting point of 217 °C (423 °F) due to its ternary eutectic behaviour. This alloy is widely used in Japan for reflow, wave, and hand soldering, as well as in the electronics industry for soldering PCBs and other electronic components. The addition of silver to the alloy provides increased mechanical strength, but may compromise wettability.
Other lead-free solder alloys include Sn96, Sn99, and Sn99.3/Cu0.7, which have melting points of 441 °F (227 °C), 430 °F (221 °C), and 441 °F (227 °C) respectively. While these alloys have higher melting points than traditional Sn63/Pb37 and Sn60/Pb40 alloys, they are not considered high-temperature solders.
When choosing a lead-free solder alloy, it is important to consider the application and the equipment available, as some alloys require higher temperatures for melting. Additionally, lead-free solder alloys may have different wettability, conductivity, price, and strength characteristics compared to lead-based solders.
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High-temperature solders
Soft solder, which is commonly used in electronics, plumbing, and sheet metal work, has a melting point range of 90 to 450 °C (190 to 840 °F; 360 to 720 K). Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing.
Hard solders are used for brazing and melt at higher temperatures. Alloys of copper with either zinc or silver are the most common. In silversmithing or jewelry making, special hard solders are used that will pass assay. They contain a high proportion of the metal being soldered, and lead is not used in these alloys. These solders vary in hardness and are designated as "enameling", "hard", "medium", "easy", and "repair". Enameling solder has a high melting point, close to that of the material itself, to prevent the joint from desoldering during firing in the enameling process.
Gold solders, such as those offered by the Indium Corporation, are another type of high-temperature solder. Gold solders are resistant to corrosion and oxidation, ensuring the joint's long-term integrity and electrical functionality. Silver-based alloys are also used for high-temperature soldering, especially in manufacturing to join metal parts that cannot be welded. Silver solders contain a high proportion of silver (up to 40%) and may also contain cadmium.
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Low-temperature solder alloys
Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Soft solder typically has a melting point range of 90 to 450 °C (190 to 840 °F; 360 to 720 K) and is commonly used in electronics, plumbing, and sheet metal work. Alloys with a melting point above 450 °C are used in hard soldering, silver soldering, or brazing.
Tin-silver-copper (Sn-Ag-Cu, or SAC) solders are a popular family of lead-free low-temperature solder alloys with a melting point of 217 °C (423 °F). They are used by two-thirds of Japanese manufacturers for reflow and wave soldering, and by about 75% of companies for hand soldering.
Another low-temperature solder alloy is Sn42/Bi57/Ag1, which is composed of 42% tin, 57% bismuth, and 1% silver. This alloy has improved wetting and fatigue characteristics compared to Sn42/Bi58 and reduces energy consumption and component-warpage-related defects.
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Frequently asked questions
Soft solder typically has a melting point range of 90 to 450 °C (190 to 840 °F; 360 to 720 K).
The melting point of 63/37 Sn-Pb is 361°F (183°C).
The melting point of 60/40 Sn-Pb is 370°F (188°C).
The melting point of lead-free solder alloys ranges from 50 to 227°C.
Solder for very hot environments, such as avionics, automotive, and downhole oil and gas wells, will have a higher temperature range, with one example being Sn10/Pb88/Ag2, which has a melting point of 570°F (299°C).
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